Electron Devices: Chapter 5: Field Effect Transistors

Enhancement MOSFET (E‒MOSFET)

Construction, Operation, Characteristics, Circuit Diagram, Parameters, Type, Symbols, Example Solved Problems

Enhancement MOSFET (E‒MOSFET) - Construction, Operation, Characteristics, Circuit Diagram, Parameters, Type, Symbols, Example Solved Problems

Questions: 1. Define threshold voltage. 2. Define pinchoff voltage. 3. Sketch and explain the construction of N‒channel enhancement type MOSFET. Give also its symbol. 4. Explain the operation of an enhancement type MOSFET. 5. Describe, with suitable sketches, the operation and characteristics (transfer, drain) of the N‒channel enhancement type MOSFET. 6. With the help of suitable diagrams explain the working of different types of MOSFET. 7. Draw a circuit diagram of the cross section of a enhancement MOSFET. Also discuss the drain and transfer characteristics for EMOSFET. 8. Explain the concept of threshold voltage in a MOSFET. 9. Discuss the characteristics of MOSFET. 10. Describe the working and characteristics of MOSFET, D MOSFET and E MOSFET. 11. Discuss your understanding on MOSFET detailing the types, construction and characteristics.

Enhancement MOSFET (E‒MOSFET)

• This type of MOSFET operates only in the enhancement mode and has no depletion mode. It differs in construction from the depletion MOSFET in that it has no physical channel.

 

1. Construction of n‒channel E‒MOSFET

• Fig. 5.13.1 shows the basic construction of n‒channel enhancement type MOSFET.

• Like, depletion type MOSFET, two highly doped n‒regions are diffused into a lightly doped p‒type substrate.

• The source and drain are taken out through metallic contacts to n‒doped regions as shown in Fig. 5.13.1.


• But the channel between two n‒regions is absent in the enhancement type MOSFET.

• The SiO2 layer is still present to isolate the gate metallic platform from the region between the drain and source, but now it is simply separated from a section of the p‒type material.

 

2. Operation, Characteristics and Parameters of n‒Channel E‒MOSFET

• On application of drain to source voltage VDS and keeping gate to source voltage zero by directly connecting gate terminal to the source terminal, practically zero current flows‒quite different from the depletion type MOSFET and JFET.

• If we increase magnitude of VGS in the positive direction, the concentration of electrons near the SiO2 surface increases.

• At a particular value of VGS there is a measurable current flow between drain and source. This value of VGS is called threshold voltage denoted by VT.

• Thus, we can say that in an enhancement type n‒channel MOSFET, a positive gate voltage above a threshold value induces a channel and hence the drain current by creating a thin layer of negative charges in the substrate region adjacent to the SiO2 layer, as shown in Fig. 5.13.2.


• The conductivity of the channel is enhanced by increasing the gate to source voltage and thus pulling more electrons into the channel.

• For any voltage below the threshold value, there is no channel.

• Since the channel does not exist with VGS = 0 V and "enhanced" by the application of a positive gate to source voltage, this type of MOSFET is called an enhancement type MOSFET.

• Fig. 5.13.3 shows the drain characteristics of an n‒channel enhancement type MOSFET. Looking at Fig. 5.13.3 we can say that as VGS increases beyond the threshold level, the density of free carriers (electrons) in the induced channel increases, increasing the drain current. However, at some point of VDS, for constant VGS, the drain current reaches a saturation level.


Fig. 5.13.3 Drain characteristics of an n‒channel enhancement type MOSFET

• The value of VDS at this point is known as pinch‒off voltage (VP). The levelling off of ID is due to a pinch‒off process. Fig. 5.13.4 shows pinch off process for n‒channel enhancement type MOSFET.


Fig. 5.13.4 Change in channel and depletion region with increasing level of VDS for a fixed value of VGS

• Fig. 5.13.5 shows the transfer characteristic for n‒channel enhancement type MOSFET.

• This characteristic is quite different from characteristic that we we obtained for JFET and depletion type MOSFET. For an n‒channel enhancement type MOSFET it is now totally in the positive VGS region and as we know ID does not flow until VGS = VT.


• For VGS > VT the relationship between drain current and VGS is nonlinear and it is given as

ID = K(VGS ‒ VT )2

           ……….(5.13.1)

• The K term is a constant that is a function of the construction of the device. The value of K can be determined from equation,

K = ID(ON) / (VGS(ON) ‒ VT )2


        ………(5.13.2)

• The parameter K is called conduction parameter. It is given by K = WμnCOX / 2L

• Where Cox is the oxide capacitance per unit area. The capacitance is given by

COX = εox / tox

where tox is the oxide thickness and εox is the oxide permittivity.

• The parameter μn is the mobility of the electrons in the inversion layer.

• The parameter W is the channel width and parameter L is the channel length.

 

Ex. 5.13.1: For N‒EMOSFET VT = 0.7 V, W= 30 μm, L=5 μm, μn = 650 cm2/V‒S, tox = 450 A (450 × 10‒8). εox = 3.9 × 8.85 × 10‒14 F/cm

Assume transistor is biased in saturation region:

i) Determine drain current when VGS = 2VT. ii) If tox is doubled, find new K.

Solution:

i) W = 30 μm = 30 × 10‒6 m = 30 × 10‒4 cm

L = 5 μm = 5 × 10‒6 m = 5 × 10‒4 cm

K = Wμnεox / 2Ltox

= [ (30×10‒4) (650) (3.9×8.85×10‒14) ] / [ 2(5×10‒4)(450×10−8) ]

= 0.1495 mA/V2

VGS = 2 VT = 2 × 0.7 = 1.4 V

iD = K (VGS ‒ VT)2 = (0.1495) (1.4 ‒ 0.7)2

= 0.0732 mA

ii) For tox = 2 × 450 × 10‒8 = 900 × 10‒8

K = Wμnεox / 2Ltox

=  [ (30×10‒4) (650) (3.9×8.85×10‒14) ] / [ 2(5×10‒4)(900×10‒8) ]

= 0.07475 mA/V2

 

Ex. 5.13.2: Evaluate the body effect coefficient (γ) in a MOSFET with Na = 3×1016/cm3, εr = 11.6 and ε0 = 8.854×10‒12 F/m and Cox = 1.726×10‒7 F/cm2.

Solution::


where εS = εr × ε0

= 11.6×8.854×10‒12 F/m

= 11.6×8.854×10‒14 F/cm

 γ = { √[2×(1.6×10‒19)×(3×1016)×(11.6×8.854×10−14) ] / [ 1.726×10‒7 ]

= 0.5753

 

3. p‒channel Enhancement Type MOSFET

• The construction of the p‒channel enhancement type MOSFET is exactly opposite to that of n‒channel enhancement type MOSFET. Here, the substrate is of n‒type and regions are of p‒type as shown in Fig. 5.13.6.6

• As shown in Fig. 5.13.7 voltage polarities and current directions are reversed.


• The drain characteristics appear exactly as in the Fig. 5.13.7 but with VDS with negative values, ID in opposite direction and VGS having opposite polarities as shown in Fig. 5.13.7.


• Fig. 5.13.8 shows the transfer characteristics of p‒channel enhancement type MOSFET.

• In the p‒channel enhancement type MOSFET, the transfer characteristic is a mirror image about the ID axis (y axis) of the transfer characteristics of n‒channel depletion type MOSFET, since the VGS is negative.


E‒MOSFET symbols

Fig. 5.13.9 shows graphic symbols for n and p‒channel enhancement type MOSFET.



Review Questions

1. Define threshold voltage.

2. Define pinchoff voltage.

3. Sketch and explain the construction of N‒channel enhancement type MOSFET. Give also its symbol.

4. Explain the operation of an enhancement type MOSFET.

5. Describe, with suitable sketches, the operation and characteristics (transfer, drain) of the N‒channel enhancement type MOSFET.

6. With the help of suitable diagrams explain the working of different types of MOSFET.

7. Draw a circuit diagram of the cross section of a enhancement MOSFET. Also discuss the drain and transfer characteristics for EMOSFET.

8. Explain the concept of threshold voltage in a MOSFET.

9. Discuss the characteristics of MOSFET.

10. Describe the working and characteristics of MOSFET, D MOSFET and E MOSFET.

11. Discuss your understanding on MOSFET detailing the types, construction and characteristics.


Electron Devices: Chapter 5: Field Effect Transistors : Tag: electronics : Construction, Operation, Characteristics, Circuit Diagram, Parameters, Type, Symbols, Example Solved Problems - Enhancement MOSFET (E‒MOSFET)


Electron Devices: Chapter 5: Field Effect Transistors



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